Advanced Power SGT Drives Humanoid Robots
Domestic Substitution Is Now the Right Time
Domestic SGT Power Management Chips
⏩ Technical benchmarks – World-class performance: The 100V PDFN5X6 features a conductive resistance as low as 1.75 mΩ, competing with the Yingli S7; the 120V SGT TOLL rivals the Yingli OpTiM OS 6.
⏩ Key customers have been verified: 58 OEM manufacturers (including Zhiyuan,Yushu, Cloud Deep, UBTECH, and Xiaomi) and 42 module manufacturers have been onboarded.
⏩Standard-setting participant: Member unit of the National Humanoid Robot Testing and Certification Working Group; the initiating organization for the group standard"Technical Specification for CR Testing of Integrated Robot Joints".
⏩ Comprehensive product portfolio: covers all voltage ranges from 40V to 150V,meeting the diverse requirements of joint drives, BMS, and robotic arms across all application scenarios.
ONE
Joint FOC Driver
(Primary Application Market for MOSFETs)
✅ Function: Drives robotic joint motors to control joint rotation
✅ Usage: One humanoid robot with 28–40 joints; each joint requires 6 MOS transistors; the entire system requires 168–240 main power MOS transistors– this represents the highest MOS transistor consumption point in the entire system.
✅ Voltage:24 V (small hand joints), 48 V (humanoid body), 72 V (large joints/quadriplegic), high-voltage version for industrial robotic arms.
✅ Representative Clients: Damiao, Tihu, Yushu, Zhiyuan, Leise, etc.
Robot Battery BMS
(24V/48V battery pack)
✅ Function: Battery charge/discharge control, cell balancing, and reverse-connection protection – ensuring battery safety.
✅Components: High-power N-MOS transistors for the main circuit; low-power P-MOS transistors for balancing and pre-charging protection.
✅Representative Customers: Weilan, Xinwangda, Yiyi Lithium Energy, Langkaiwei, Xiangong AMR
Agile Hands / End Effector
(The robot's "last centimeter")
✅ Function: Drives a finger micro-motor to execute grasping movements
✅ High density of deployment: Over 120 micro-MOS devices per hand; the number of micro-MOS devices in a single hand can even exceed the total number of joints in the entire body.
✅ Model: 24/30 V; prioritizes compact DFN3×3 package; also powers the tactile sensor.
✅Representative clients: Yinsi Robotics, Lingxin Qiaoshou, Aoyi, and the Dex Series.
TWO
"The inaugural year of mass production for humanoid robots"
The year 2025 is hailed as the "inaugural year for the mass production of humanoid robots." Industry data shows that in 2025, domestic shipments of humanoid robots reached 18,000 units – a year-on-year surge of over 650% –corresponding to a MOS usage of 3.5 MK.
The annual installation volume of humanoid robots is approximately 16,000 units.
According to market research firm CounterPoint Research, the global annual installation volume of humanoid robots is expected to reach approximately 16,000 units by 2025, with Chinese manufacturers accounting for over 80% of this market.
Yushu's actual shipment volume for 2025 exceeded 5,500 units.
Yushu's actual annual shipment volume of humanoid robots exceeded 5,500 units in 2025; the number of units produced through mass production in 2025 surpassed 6,500 units.
The top player's sales have surged to the billion-level.
The sales revenue of leading companies has surged to the billion-level; among them, UBTECH's total annual orders approached RMB 1.4 billion, while Yushu Technology's total orders neared RMB 1.2 billion. In June alone, these two companies secured a RMB 124 million procurement order for humanoid robots from a China Mobile subsidiary.
THREE
Top 10 Chinese enterprises by robotic dog sales volume (2025)
⏩ By 2025, global shipments of four-legged robots are expected to reach approximately 82,000 units, with China accounting for 80% of this total (65,000 units), corresponding to a MOS consumption of 45,000 units;
⏩ The global market size is approximately RMB 7 billion, with China accounting for about RMB 5 billion.
Industrial market
Shipments account for 30% of total sales; core applications include inspection, logistics, and equipment maintenance; CloudDeep Technology's products, such as the X3, have been deployed in over 3 0 0 implementation cases across the chemical and power industries.
Consumer market
With shipments accounting for 65% of total sales, the company focuses primarily on products designed for family companionship and educational/research applications – including the Blue Intelligence BabyAlpha, Yushu Technology's Go1, and Vita Power's Vbot Super Energy Dog – which have successfully captured the market thanks to their "high cost-effectiveness combined with strong interactivity."
Specialized Market
5% market share; focusing on emergency rescue and specialized industries, with products such as the MOVENEW P1 (designed for extreme environments) and the Qiteng Robot X3 Stable (explosion-proof certified), which are deployed in petrochemical and disaster rescue scenarios.
WORK REPOET
FOUR
⏩ Integrated joints were previously primarily used in collaborative robots, accounting for 70% of applications with relatively stable growth; since 2024, the primary drivers of growth have been humanoid robots and robotic dogs, with an estimated annual usage of 20,000 units
⏩ Robotic dogs typically feature 12–16 joint actuators (motors + planetary reducers), accounting for over 50% of the total cost.
WORK REPOET
FIVE
Core Pain Points
The trade-off between on-resistance and switching speed
To reduce conduction loss (improve efficiency), a low on‑resistance is required. However, devices with low Rds(on) usually feature high gate charge (Qg) and parasitic capacitances (Ciss, Coss, Crss), which slows down the switching speed and increases switching loss. Under high‑frequency PWM control in robots (tens to hundreds of kHz), switching loss becomes quite prominent.
Impact on robots: Reduced system efficiency causes severe heat generation, limiting power density and battery life. At high frequencies, switching loss may even exceed conduction loss and become the primary heat source.
SineSemi Solution
The proprietary IDOS technology represents a groundbreaking breakthrough in performance, achieving optimal comprehensive dynamic and static characteristics (FOM), fundamentally resolving inherent design challenges while featuring extremely low switching losses and superior body diode characteristics; additionally, it incorporates integrated GaN technology.
System‑level Solution
Optimize the PWM strategy, e.g., by employing a three-level topology to reduce device stress.
The body diode exhibits poor reverse recovery behavior.
In a bridge circuit (e.g., a three-phase full-bridge circuit), the MOSFET's body diode acts as a freewheeling diode during the dead-time period. However, this diode exhibits a large reverse recovery charge (Qrr), a long reverse recovery time (trr), and a "hard" reverse recovery characteristic.
Impact on robots:
This generates significant peak current and voltage oscillations, which cause severe electromagnetic interference and compromise the stability of the control system.
Increases switching losses and, in extreme cases, may pose a "short-circuit" risk, potentially burning out the components.
This limits the increase in switching frequency, thereby affecting the response speed and control accuracy of the current loop.
SineSemi Solution
Zhongjing's next-generation SGT products feature an integrated fast-recovery diode within the chip, resulting in extremely low Qrр and Trр values.
System‑level Solution
An external Schottky diode for current limiting can be used, but this increases both cost and layout complexity.
Gate Drive Design Challenges
Insufficient driving capability can result in slow switching transitions and increased power loss; excessive driving overshoot may cause gate oscillation and EMI issues.
Impact on robots:
Switching waveform distortion leads to inaccurate control and motor torque pulsation.
Excessive EMI levels require resolution through complex filtering and shielding techniques, which increases both cost and device size.
High requirements are placed on the driving chip's peak current, negative-voltage shutdown capability, and protection functions (e.g., saturation release detection).
SineSemi Solution
Integrated MOSFET Module: Optimized internal MOSFET connection paths, optimized PCB drive circuits, and reduced parasitic parameters.Specialized gate drive IC: Provides powerful drive capability and comprehensive protection features
System‑level Solution
Carefully design the drive circuit layout to minimize the drive loop length as much as possible, and utilize gate resistance to optimize switch switching speed.
Reliability‑related Pain Point
Vulnerable SOA Security Work Area
MOSFETs are subjected to both high voltage and large current at the instant of switching. Device failure is highly likely if the operating point exceeds its Safe Operating Area (SOA). This is especially true under dynamic operating conditions of robots such as emergency stop, motor stall and abrupt load changes.
Impact on robots: Device burnout is one of the most common failures of servo drivers. Insufficient robustness limits robot applications in scenarios with high overload and high‑dynamic‑performance requirements.
SineSemi Solution
Select devices with enhanced snow burst tolerance and a wider SOA.
Power Module: Integrates multiple MOSFETs with driving and protection circuits, delivering enhanced thermal performance and consistency.
System‑level Solution
Enhance the design of overcurrent, overvoltage, and overtemperature protection circuits; employ soft-switching technology to reduce switching stress.
Thermal management versus power density trade-off
The robotic joint space is extremely limited, necessitating highly integrated and compact actuators (high power density); however, all energy losses ultimately convert into heat, which must be dissipated within the confined space.
Impact on robots:
The use of high-performance heat sinks or liquid cooling increases cost and structural complexity.
An excessively high junction temperature (Tj) can increase Rds(on), create positive feedback, accelerate thermal failure, and reduce long-term reliability.
SineSemi Solution
Improved packaging: The adoption of low thermal resistance packaging technologies, such as Cu-clip packaging technology and RDL redistribution layer technology, facilitates heat dissipation.
System‑level Solution
Utilizes advanced heat dissipation technologies, such as thermal silicone grease, phase-change materials, uniform-temperature plates, or even liquid cooling.
Parasitic parameters and high-frequency oscillation
The parasitic inductance in the PCB layout and the parasitic capacitance of the MOSFET can form an LC resonant circuit. Under high-frequency switching conditions, severe oscillations may occur in the drain voltage (Vds) and the gate voltage (Vgs).
Impact on robots:
Overvoltage breakdown of the MOSFET; unintended conduction, leading to a direct short circuit between the upper and lower transistors; measurement signal distortion, which affects the accuracy of current sampling.
SineSemi Solution
Internal parameter optimization of Zhongjing Chip further enhances the device's inherent anti-interference capability; an integrated internal RC snubber circuit provides a certain degree of oscillation absorption capability.
System‑level Solution
An external Ross-Coss absorption circuit is added to reduce oscillations.
Integration & Cost Pain Point
Non-uniformity in the parallel connection of multiple devices
Multiple MOSFETs are often connected in parallel to meet high‑current requirements. However, current cannot be evenly distributed due to device‑parameter dispersion, such as Vgs(th) and Rds(on).
Impact on robots: Individual devices may bear excess current and fail prematurely from local overheating, triggering a cascading failure effect. Careful component selection and matching are required, which raises costs and process complexity.
SineSemi Solution
Implementing a bin-based management approach to keep the variation in the device's Vgs(Th) parameter within 0.3 V.
System‑level Solution
Use of source-side series-connected low-resistance components to enhance current balancing; optimize the symmetry of the PCB layout.
成本压力
The robotics industry—particularly the consumer and collaborative robotics segments—is highly cost-sensitive. MOSFETs capable of meeting the aforementioned high-performance and high-reliability requirements (e.g., those offered by leading international manufacturers such as Infineon and TI) are expensive.
Impact on robots:A challenging trade-off between performance and cost sometimes requires sacrificing certain performance metrics.
SineSemi Solution
Backed by the Head Circular Wafer and Packaging Plant, robust supply chain capabilities, and systematic cost reduction capabilities.
System‑level Solution
Balancing product performance against system cost
Solutions
48V Solution — Humanoid Robots
Solutions
72V Solution — Quadruped Robots / Humanoid Robots
Success Cases
Robot Joint Industry
Robot Joint Motor Module
Innovative 6 mm × 6.3 mm Package for Robotic Elbow Joints
Innovative Integrated Miniaturization Solution for Dexterous Hands
Advanced Package
Advanced Power‑Package Roadmap: Striving to Become a Domestic Industry Leader
SINESEMI
Robotics Industry Component Selection Recommendations
Complete Product Matrix, One-stop Solutions, Price System Basically Established
➡ Full portfolio of products covering all mainstream voltage classes
➡ Validated by industry customers, backed by abundant success cases and customer orders
➡ Top-spec products outperform competitors; domestically No.1 in technological advancement and recognized by customers
For more humanoid robot cases, please contact Junmin Technology!
END
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